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You can download the Program Agenda of IWAPS-2020 here: IWAPS2020ProgramAgenda.pdf

 

Group Photo could be downloaded here -- IWAPS2020GroupPhoto.zip 

Cite: Author name(s), "Presentation title," the 4th International Workshop on Advanced Patterning Solutions (IWAPS-2020), Chengdu China, 5-6 Nov, 2020.

No	Author and Presentation	download
Day1_AM_S1_1	H. –S. Philip Wong (Stanford University): (KEYNOTE, Online) Materials and Devices for 3D Integrated Circuits	IWAPS2020Keynote_ Wong_StanfordUniv.pdf
Day1_AM_S1_2	Nan Fu (Hisilicon): (INVITED) Patterning process-window aware DTCO for 12nm FinFET technology and fast yield ramp up
Day1_AM_S2_1	Steffen Schulze (Mentor): (INVITED, Online) Providing Predictive Design & Process Insights to Accelerate Yield Ramp with Calibre Fab Solutions
Day1_AM_S2_2	Xuelong Shi 时雪龙 (ICRD): (INVITED) Fast and Accurate Machine Learning Inverse Lithography Using Physics Based Feature Maps and Specially Designed DCNN
Day1_AM_S2_3	Xiaodong Meng (AMEDAC 全芯制造)： (INVITED) The impact of lenses aberration on CD and position for low k1 lithography	Day1_AM_S2_3_ Meng_AMEDAC.pdf
Day1_PM_S1_1	Masami Ikota (Hitachi High-Tech): (INVITED, Online) Electron Beam Metrology for Advanced Patterning	Day1_PM_S1_1_ Ikota_Hitachi.pdf
Day1_PM_S1_2	Dean Wu 吴振国 (YMTC 长江存储): (INVITED) 3D NAND Dual-Deck OVL measurement and control
Day1_PM_S1_3	Junjun Zhang 张君君 (CXMT 长鑫存储): Real time process monitoring using diffraction-based overlay measurements from YieldStar
Day1_PM_S1_4	Dongyu Xu (HLMC 华力微电子): CDSEM-Assisted Optical Metrology for Overlay Control
Day1_PM_S2_1	Joost Frenken (ARCNL): (KEYNOTE, Online) Materials challenges in EUV lithography
Day1_PM_S2_2	Laurent PAIN (CEA Tech-Leti): (INVITED, Online) The virtuous circles of the RTOs -- How to support and boost technology developments from materials to integration	Day1_PM_S2_2_ PAIN_Leti.pdf
Day1_PM_S2_3	Fred Brouwer (ARCNL): (INVITED, Online) Photon-induced reactions in hybrid molecular EUV photoresists	Day1_PM_S2_2_ Brouwer_ARCNL.pdf
Day2A_AM_S1_1	Masahiro Morita (Nikon): (INVITED, Online) Integrated Solution of Nikon Exposure, Metrology and Inspection	Day2A_AM_S1_1_ Morita_Nikon.pdf
Day2A_AM_S1_2	Keita SAKAI (Canon Inc.): (INVITED, Online) Nanoimprint Performance Improvements for High Volume Semiconductor Manufacturing
Day2A_AM_S1_3	Shingo Yoshikawa (DNP): (INVITED, Online) 5nm node's EUV mask process studies using MBMW
Day2A_AM_S2_1	Andy Chan (Microsoft): (INVITED, Online) Running OPC workload in Azure, what we learned thus far	Day2A_AM_S2_1_ Chan_Microsoft.pdf
Day2A_AM_S2_2	Peng Liu (Synopsys Inc.): (INVITED, Online) Mask Synthesis using Machine Learning Software & Hardware for EUV Lithography	Day2A_AM_S2_2_ Liu_Synopsys.pdf
Day2A_AM_S2_3	Boer Zhu (ASML): (INVITED) Simulation investigation of resolution enhancement techniques (RETs) in low k1 EUV	Day2A_AM_S2_3_ Boer_ASML.pdf
Day2A_AM_S2_4	Fei Peng (Wuhan University)： Mask Optimization based on artificial desired pattern
Day2A_PM_S1_1	Xuedong Fan (HLMC): (INVITED) A novel SEM image based advanced lithography process control providing quick feedback
Day2A_PM_S1_2	Billy Tang (Cymer): (INVITED) Improving DOF for an Advanced 3D NAND Via Layer using Multi-Focal Imaging
Day2A_PM_S1_3	Mustafa BADAROGLU (IEEE IRDS More Moore): (INVITED, Online) More Moore roadmap for high-volume manufacturing – IRDS view	Day2A_PM_S1_3_ Badaroglu_IRDS.pdf
Day2A_PM_S2_1	Toshihiro Oga (Gigaphoton Inc.): (INVITED, Online) Imaging performance improvement by spectral performance stability and Optical Pulse Stretching functionality
Day2A_PM_S2_2	Yonggang Xie 谢永刚 (KingSemi): (INVITED) Defect reduction and particle control in localized Track	Day2A_PM_S2_2_ Xie_KingSemi.pdf
Day2A_PM_S2_3	Yiming Zhu (HLMC): Domestic clean track development and improvement for advance node production
Day2B_AM_S1_1	Gary Zhang (ASML HMI): (INVITED, Online) Enabling Holistic Patterning Applications with High Speed E-beam Metrology and Inspection
Day2B_AM_S1_2	Bo Hua (KLA): (INVITED) Broadband Plasma Optical Wafer Defect Inspection for Mask Qualification
Day2B_AM_S1_3	Yunsheng Xia (CXMT 长鑫存储): OPO Measurement Improvement in Advanced DRAM with Tunable Wavelength Imaging
Day2B_AM_S2_1	Wei Yuan (ICRD): (INVITED) Machine Learning Hotspot Prediction Significantly Helps to Increase Capture Rate on Wafer	Day2B_AM_S2_1_ Yuan_ICRD.pdf
Day2B_AM_S2_2	Qian Xie (Mentor)： (INVITED, Online) Reducing Systematic Defects using Calibre Wafer Defect Management and Machine Learning Solutions
Day2B_AM_S2_3	Xuelong Shi (ICRD): An effective method of contour extraction for SEM image based on DCNN
Day2B_AM_S2_4	Zengzhi Huang (CUMEC)： The Preliminary Rounds of OPC Development in 180nm node Silicon Photonics MPW platform	Day2B_AM_S2_4_ Huang_CUMEC.pdf
Day2B_PM_S1_1	Takanori KAWAKAMI (JSR)： (INVITED, Online) Advanced Lithography Material Status toward 5nm Node and beyond
Day2B_PM_S1_2	Sams Hsu (PiBond): New silicon-based materials for semiconductor manufacturing processes
Day2B_PM_S1_3	Garry Wang (3M): 3M Immobilized Micro-Bed Ion Exchange Resin Bed Technology Treatment of PGMEA	Day2B_PM_S1_3_ Wang_3M.pdf
Day2B_PM_S1_4	TORU FUJIMORI (FUJIFILM): (Online) How to reduce the stochastic issue in EUV lithography	Day2B_PM_S1_4_ Fujimori_Fujifilm.pdf
Day2B_PM_S2_1	Eberhard Manske (Technische Universität Ilmenau): (INVITED, Online) Alternative tip- and laser- based nanofabrication up to 100 mm on flat and non-flat surfaces with subnanometre precision
Day2B_PM_S2_2	Qi-Huo Wei (Southern University of Science and Technology南方科技大学): (INVITED) Photopatterning Molecular Orientations with Plasmonic Metamasks
Day2B_PM_S2_3	Shisheng Xiong (Fudan University): (INVITED) Sub-10 nm high-resolution patterning combining directed self-assembly of block copolymer and double patterning
Day2B_PM_S2_4	Gaofeng Liang (Chongqing University): Designing of multilayers for evanescent wave-based interference lithography	Day2B_PM_S2_4_ Liang_ChongqingUni.pdf