Program Agenda (IWAPS2021ProgramAgenda.pdf)
The proceedings have been published in IEEE Xplore.
Conference Group Photo (IWAPS2021GroupPhoto)
Cite: Author(s), "Presentation title," the 5th International Workshop on Advanced Patterning Solutions (IWAPS-2021), Foshan China, 12-13 Dec., 2021.
No
Author
Presentation Title
Download
Day1-AM-1
Vivek Singh (Nvidia)
(KEYNOTE) Computational Lithography:
Accelerating the future
Day1-AM-2
Anthony Yen (ASML)
(KEYNOTE) Extending the limits of semiconductor
lithography
Day1-AM-3
John Sturtevant (Siemens EDA)
(KEYNOTE) Curvy Masks Ahead
Day1-AM-4
Keita Sakai (Canon)
(INVITED) Addressing NIL Integration for
Semiconductor Device Manufacturing
Day1-AM-5
Xuemei Chen (KLA)
(INVITED) EPE challenges, analytics, and
predictive control for advanced patterning
Day1-PM-1
Takashi Masuyuki (Nikon)
(INVITED) Lithographic solutions for 3D
structured devices
Day1-PM-2
Kan Zhou (Shanghai Huali)
(INVITED) Dose control strategy using random
logic device patterns and massive metrology in a foundry high volume
manufactruing environment
Day1PM2_KanZhou.pdf
Day1-PM-3
Debao Ding (CXMT)
Reticle Haze Characterization and Management in
a DRAM fab
Day1PM3_DebaoDing.pdf
Day1-PM-4
Billy Tang (ASML- Cymer Light Sources)
(INVITED) Holistic imaging for yield
improvements enabled by high-availability, and low-environmental impact Cymer
ArFi lightsource
Day1-PM-5
Tilmann Heil (Carl Zeiss)
(INVITED) Current and Future Mask Making
Challenges from an equipment manufacturer’s point of view
Day1-PM-6
Zhen Ma (Edwards)
EUV vacuum system safety while maximizing
process productivity
Day1PM6_ZhenMa.pdf
Day1-PM-7
Yonggang Xie (KINGSEMI 沈阳芯源)
Native Front End Track Application
Day2-A-AM-1
Naoya Hayashi (DNP)
(KEYNOTE) Sustainable and “Green” Lithography
using Advanced Mask Technologies
Day2A_AM1_KeynoteDrHayashi.pdf
Day2-A-AM-2
Fei Wang (ASML HMI)
(INVITED) Maximizing patterning performance and
yield with high speed e-beam metrology and inspection
Day2-A-AM-3
Masami Ikota (Hitachi High-Tech)
(INVITED) Electron Beam Metrology Challenges to
the Next Process Node
Day2-A-AM-4
Ying Guangchi (Shanghai Huali Integrated
Circuit Cooperation, 上海华力)
(INVITED) Study on Lithography Defect Reduction
for 19nm NAND SADP Process
Day2-A-AM-5
Liang Wu (ASML)
A Novel Control Strategy to Improve On-Product
Overlay with Context-Based Wafer Grouping for an Advanced Node Logic Layer in
High-Volume Manufacturing Environment
Day2A_AM5_LiangWu.pdf
Day2-A-AM-6
Wei Zhang (CXMT 长鑫存储)：
Scribe Line Self Reference Targets to enable
Accurate and Robust After-Etch Overlay Metrology of Active layer
Day2A_AM6_WeiZhang.pdf
Day2-A-AM-7
Junyi Bao (ASML)
Using Feedforward in On-Product Overlay
Run-to-Run Control Loop for Reducing Lot-to-Lot Variation for a MEOL Layer of
an Advanced Logic Node
Day2A_AM7_JunyiBao.pdf
Day2-A-PM-1
Takanori Kawakami (JSR)
(INVITED) Advanced Lithography Material Status
beyond 5nm Node
Day2-A-PM-2
Toru Fujimori (FUJIFILM Corporation)
(INVITED) Negative tone imaging (NTI) process
for ArF immersion and EUV lithography to improve ‘Chemical Stochastic’
Day2A_PM2_ToruFujimori.pdf
Day2-A-PM-3
Qiang Wu (Fudan University, 复旦大学)
Process Model Guided Photoresist Formulation
Optimization
Day2A_PM3_QiangWu.pdf
Day2-A-PM-4
Jiantao Wang (Shanghai Huali)
Photoresist Material Gaping Filling Loading
Improvement from Pattern Density Perspective
Day2A_PM4_JiantaoWang.pdf
Day2-A-PM-5
Michael Shifrin (Nova)
Implementation of Machine Learning in Advanced
Pattern Process Control Metrology
Day2-A-PM-6
Chen Cheng (Shanghai Huali)
A Novel Research of ASML&Nikon lithography
illumination matching
Day2-A-PM-7
Wei Chen (KLA)
Integrated Automation Solution Driving Zero
Yield Loss under Reticle Management
Day2A_PM7_WeiChen.pdf
Day2-A-PM-8
Jie Du (CXMT 长鑫存储)
Computational ASCAL verification with inline
ASCAL in high volume manufacturing fab for ArF XT:1460K with LOCO-B
Day2A_PM8_JieDu.pdf
Day2-B-AM-1
Qiang Wu (Fudan University)：
(INVITED) The Discussion of the Typical BEOL
Design Rules from 3 nm to 2 nm Logic Process with EUV and High NA EUV
Lithography
Day2B_AM1_QiangWu.pdf
Day2-B-AM-2
Germain Fenger (Siemens EDA)
(INVITED) Predict the curve for the most
advanced technology nodes
Day2-B-AM-3
Jianliang Li (AMEDAC 全芯智造)
(INVITED) An innovative method to retain
optical kernels by keeping Bossung curves smoothness
Day2B_AM3_JianliangLi.pdf
Day2-B-AM-4
Zongchang Yu (DJEL)
(INVITED) A novel approach makes yield more
predictable
Day2-B-AM-5
Toshihiro Oga (Gigaphoton)
(INVITED) ArF lightsource “GT66A” for
next-generation immersion lithography enhancing EPE and CD performance
Day2-B-AM-6
Jiaqi Liu (Shanghai Huali)
(INVITED) Pattern Centric Machine Learning
Approach to Uncover Process Defects During Wafer Inspection and Review
Day2B_AM6_JiaqiLiu.pdf
Day2-B-PM-1
XuanMing Duan (Jinan University 暨南大学)
(INVITED) Sub-Diffraction Lithography with
Ultrafast Laser
Day2-B-PM-2
Xiaobin Xu (Tongji University 同济大学)
(INVITED) Exploitation of large-area
nanoscale-patterning approaches and their applications in nanodevices
Day2-B-PM-3
Jie Liu (Hunan University 湖南大学)
HNU-EBL: A Software Toolkits for Electron Beam
Lithography Simulation and Optimization
Day2B_PM3_JieLiu.pdf
Day2-B-PM-4
RAN JI (Qingdao Germanlitho Co.,Ltd青岛天仁微纳公司)
Industrial application of nano-imprint in the
production of micro - nano optical devices
Day2B_PM4_RanJi.pdf
Day2-B-PM-5
Jiao Huang (ASML)
Genetic algorithm to speed up modeling
turn-around-time
Day2B_PM5_JiaoHuang.pdf
Day2-B-PM-6
Rongzheng Ding (Fudan University)
HD SRAM size shrink beyond 7nm by CFET without
EUV
Day2B_PM6_RongzhengDing.pdf
Day2-B-PM-7
Yanli Li (Fudan University)
A Study of the Advantages to the
Photolithography Process brought by the HiNA EUV Exposure Tool
Day2B_PM7_YanliLi.pdf
Day2-B-PM-8
Yingfang Wang (HFC)
Modeling Sampling Strategy Optimization by
Machine Learning Based Analysis
Day2B_PM8_YingfangWang.pdf
