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You can download the Program Agenda of IWAPS-2020 here: IWAPS2020ProgramAgenda.pdf
Group Photo could be downloaded here -- IWAPS2020GroupPhoto.zip
Cite: Author name(s), "Presentation title," the 4th International Workshop on Advanced Patterning Solutions (IWAPS-2020), Chengdu China, 5-6 Nov, 2020.
No
Author and Presentation
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Day1_AM_S1_1
H. –S. Philip Wong (Stanford University):
(KEYNOTE, Online) Materials and Devices for 3D Integrated Circuits
IWAPS2020Keynote_
Wong_StanfordUniv.pdf
Day1_AM_S1_2
Nan Fu (Hisilicon):
(INVITED) Patterning process-window aware DTCO for 12nm FinFET technology and fast yield ramp up
Day1_AM_S2_1
Steffen Schulze (Mentor):
(INVITED, Online) Providing Predictive Design & Process Insights to Accelerate Yield Ramp with Calibre Fab Solutions
Day1_AM_S2_2
Xuelong Shi 时雪龙 (ICRD):
(INVITED) Fast and Accurate Machine Learning Inverse Lithography Using Physics Based Feature Maps and Specially Designed DCNN
Day1_AM_S2_3
Xiaodong Meng (AMEDAC 全芯制造)：
(INVITED) The impact of lenses aberration on CD and position for low k1 lithography
Day1_AM_S2_3_
Meng_AMEDAC.pdf
Day1_PM_S1_1
Masami Ikota (Hitachi High-Tech):
(INVITED, Online) Electron Beam Metrology for Advanced Patterning
Day1_PM_S1_1_
Ikota_Hitachi.pdf
Day1_PM_S1_2
Dean Wu 吴振国 (YMTC 长江存储):
(INVITED) 3D NAND Dual-Deck OVL measurement and control
Day1_PM_S1_3
Junjun Zhang 张君君 (CXMT 长鑫存储):
Real time process monitoring using diffraction-based overlay measurements from YieldStar
Day1_PM_S1_4
Dongyu Xu (HLMC 华力微电子):
CDSEM-Assisted Optical Metrology for Overlay Control
Day1_PM_S2_1
Joost Frenken (ARCNL):
(KEYNOTE, Online) Materials challenges in EUV lithography
Day1_PM_S2_2
Laurent PAIN (CEA Tech-Leti):
(INVITED, Online) The virtuous circles of the RTOs -- How to support and boost technology developments from materials to integration
Day1_PM_S2_2_
PAIN_Leti.pdf
Day1_PM_S2_3
Fred Brouwer (ARCNL):
(INVITED, Online) Photon-induced reactions in hybrid molecular EUV photoresists
Day1_PM_S2_2_
Brouwer_ARCNL.pdf
Day2A_AM_S1_1
Masahiro Morita (Nikon):
(INVITED, Online) Integrated Solution of Nikon Exposure, Metrology and Inspection
Day2A_AM_S1_1_
Morita_Nikon.pdf
Day2A_AM_S1_2
Keita SAKAI (Canon Inc.):
(INVITED, Online) Nanoimprint Performance Improvements for High Volume Semiconductor Manufacturing
Day2A_AM_S1_3
Shingo Yoshikawa (DNP):
(INVITED, Online) 5nm node's EUV mask process studies using MBMW
Day2A_AM_S2_1
Andy Chan (Microsoft):
(INVITED, Online) Running OPC workload in Azure, what we learned thus far
Day2A_AM_S2_1_
Chan_Microsoft.pdf
Day2A_AM_S2_2
Peng Liu (Synopsys Inc.):
(INVITED, Online) Mask Synthesis using Machine Learning Software & Hardware for EUV Lithography
Day2A_AM_S2_2_
Liu_Synopsys.pdf
Day2A_AM_S2_3
Boer Zhu (ASML):
(INVITED) Simulation investigation of resolution enhancement techniques (RETs) in low k1 EUV
Day2A_AM_S2_3_
Boer_ASML.pdf
Day2A_AM_S2_4
Fei Peng (Wuhan University)：
Mask Optimization based on artificial desired pattern
Day2A_PM_S1_1
Xuedong Fan (HLMC):
(INVITED) A novel SEM image based advanced lithography process control providing quick feedback
Day2A_PM_S1_2
Billy Tang (Cymer):
(INVITED) Improving DOF for an Advanced 3D NAND Via Layer using Multi-Focal Imaging
Day2A_PM_S1_3
Mustafa BADAROGLU (IEEE IRDS More Moore):
(INVITED, Online) More Moore roadmap for high-volume manufacturing – IRDS view
Day2A_PM_S1_3_
Badaroglu_IRDS.pdf
Day2A_PM_S2_1
Toshihiro Oga (Gigaphoton Inc.):
(INVITED, Online) Imaging performance improvement by spectral performance stability and Optical Pulse Stretching functionality
Day2A_PM_S2_2
Yonggang Xie 谢永刚 (KingSemi):
(INVITED) Defect reduction and particle control in localized Track
Day2A_PM_S2_2_
Xie_KingSemi.pdf
Day2A_PM_S2_3
Yiming Zhu (HLMC):
Domestic clean track development and improvement for advance node production
Day2B_AM_S1_1
Gary Zhang (ASML HMI):
(INVITED, Online) Enabling Holistic Patterning Applications with High Speed E-beam Metrology and Inspection
Day2B_AM_S1_2
Bo Hua (KLA):
(INVITED) Broadband Plasma Optical Wafer Defect Inspection for Mask Qualification
Day2B_AM_S1_3
Yunsheng Xia (CXMT 长鑫存储):
OPO Measurement Improvement in Advanced DRAM with Tunable Wavelength Imaging
Day2B_AM_S2_1
Wei Yuan (ICRD):
(INVITED) Machine Learning Hotspot Prediction Significantly Helps to Increase Capture Rate on Wafer
Day2B_AM_S2_1_
Yuan_ICRD.pdf
Day2B_AM_S2_2
Qian Xie (Mentor)：
(INVITED, Online) Reducing Systematic Defects using Calibre Wafer Defect Management and Machine Learning Solutions
Day2B_AM_S2_3
Xuelong Shi (ICRD):
An effective method of contour extraction for SEM image based on DCNN
Day2B_AM_S2_4
Zengzhi Huang (CUMEC)：
The Preliminary Rounds of OPC Development in 180nm node Silicon Photonics MPW platform
Day2B_AM_S2_4_
Huang_CUMEC.pdf
Day2B_PM_S1_1
Takanori KAWAKAMI (JSR)：
(INVITED, Online) Advanced Lithography Material Status toward 5nm Node and beyond
Day2B_PM_S1_2
Sams Hsu (PiBond):
New silicon-based materials for semiconductor manufacturing processes
Day2B_PM_S1_3
Garry Wang (3M):
3M Immobilized Micro-Bed Ion Exchange Resin Bed Technology Treatment of PGMEA
Day2B_PM_S1_3_
Wang_3M.pdf
Day2B_PM_S1_4
TORU FUJIMORI (FUJIFILM):
(Online) How to reduce the stochastic issue in EUV lithography
Day2B_PM_S1_4_
Fujimori_Fujifilm.pdf
Day2B_PM_S2_1
Eberhard Manske (Technische Universität Ilmenau):
(INVITED, Online) Alternative tip- and laser- based nanofabrication up to 100 mm on flat and non-flat surfaces with subnanometre precision
Day2B_PM_S2_2
Qi-Huo Wei (Southern University of Science and Technology南方科技大学):
(INVITED) Photopatterning Molecular Orientations with Plasmonic Metamasks
Day2B_PM_S2_3
Shisheng Xiong (Fudan University):
(INVITED) Sub-10 nm high-resolution patterning combining directed self-assembly of block copolymer and double patterning
Day2B_PM_S2_4
Gaofeng Liang (Chongqing University):
Designing of multilayers for evanescent wave-based interference lithography
Day2B_PM_S2_4_
Liang_ChongqingUni.pdf
