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Program Agenda (IWAPS2021ProgramAgenda.pdf)

The proceedings have been published in IEEE Xplore. 

Conference Group Photo (IWAPS2021GroupPhoto)

Cite: Author(s), "Presentation title," the 5th International Workshop on Advanced Patterning Solutions (IWAPS-2021), Foshan China, 12-13 Dec., 2021.

No Author Presentation Title Download
Day1-AM-1 Vivek Singh (Nvidia) (KEYNOTE) Computational Lithography: Accelerating the future
Day1-AM-2 Anthony Yen (ASML) (KEYNOTE) Extending the limits of semiconductor lithography
Day1-AM-3 John Sturtevant (Siemens EDA) (KEYNOTE) Curvy Masks Ahead
Day1-AM-4 Keita Sakai (Canon) (INVITED) Addressing NIL Integration for Semiconductor Device Manufacturing
Day1-AM-5 Xuemei Chen (KLA) (INVITED) EPE challenges, analytics, and predictive control for advanced patterning
Day1-PM-1 Takashi Masuyuki (Nikon) (INVITED) Lithographic solutions for 3D structured devices
Day1-PM-2 Kan Zhou (Shanghai Huali) (INVITED) Dose control strategy using random logic device patterns and massive metrology in a foundry high volume manufactruing environment Day1PM2_KanZhou.pdf
Day1-PM-3 Debao Ding (CXMT) Reticle Haze Characterization and Management in a DRAM fab Day1PM3_DebaoDing.pdf
Day1-PM-4 Billy Tang (ASML- Cymer Light Sources) (INVITED) Holistic imaging for yield improvements enabled by high-availability, and low-environmental impact Cymer ArFi lightsource
Day1-PM-5 Tilmann Heil (Carl Zeiss) (INVITED) Current and Future Mask Making Challenges from an equipment manufacturer’s point of view
Day1-PM-6 Zhen Ma (Edwards) EUV vacuum system safety while maximizing process productivity Day1PM6_ZhenMa.pdf
Day1-PM-7 Yonggang Xie (KINGSEMI 沈阳芯源) Native Front End Track Application
Day2-A-AM-1 Naoya Hayashi (DNP) (KEYNOTE) Sustainable and “Green” Lithography using Advanced Mask Technologies Day2A_AM1_KeynoteDrHayashi.pdf
Day2-A-AM-2 Fei Wang (ASML HMI) (INVITED) Maximizing patterning performance and yield with high speed e-beam metrology and inspection
Day2-A-AM-3 Masami Ikota (Hitachi High-Tech) (INVITED) Electron Beam Metrology Challenges to the Next Process Node
Day2-A-AM-4 Ying Guangchi (Shanghai Huali Integrated Circuit Cooperation, 上海华力) (INVITED) Study on Lithography Defect Reduction for 19nm NAND SADP Process
Day2-A-AM-5 Liang Wu (ASML) A Novel Control Strategy to Improve On-Product Overlay with Context-Based Wafer Grouping for an Advanced Node Logic Layer in High-Volume Manufacturing Environment Day2A_AM5_LiangWu.pdf
Day2-A-AM-6 Wei Zhang (CXMT 长鑫存储): Scribe Line Self Reference Targets to enable Accurate and Robust After-Etch Overlay Metrology of Active layer Day2A_AM6_WeiZhang.pdf
Day2-A-AM-7 Junyi Bao (ASML) Using Feedforward in On-Product Overlay Run-to-Run Control Loop for Reducing Lot-to-Lot Variation for a MEOL Layer of an Advanced Logic Node Day2A_AM7_JunyiBao.pdf
Day2-A-PM-1 Takanori Kawakami (JSR) (INVITED) Advanced Lithography Material Status beyond 5nm Node
Day2-A-PM-2 Toru Fujimori (FUJIFILM Corporation) (INVITED) Negative tone imaging (NTI) process for ArF immersion and EUV lithography to improve ‘Chemical Stochastic’ Day2A_PM2_ToruFujimori.pdf
Day2-A-PM-3 Qiang Wu (Fudan University, 复旦大学) Process Model Guided Photoresist Formulation Optimization Day2A_PM3_QiangWu.pdf
Day2-A-PM-4 Jiantao Wang (Shanghai Huali) Photoresist Material Gaping Filling Loading Improvement from Pattern Density Perspective Day2A_PM4_JiantaoWang.pdf
Day2-A-PM-5 Michael Shifrin (Nova) Implementation of Machine Learning in Advanced Pattern Process Control Metrology
Day2-A-PM-6 Chen Cheng (Shanghai Huali) A Novel Research of ASML&Nikon lithography illumination matching
Day2-A-PM-7 Wei Chen (KLA) Integrated Automation Solution Driving Zero Yield Loss under Reticle Management Day2A_PM7_WeiChen.pdf
Day2-A-PM-8 Jie Du (CXMT 长鑫存储) Computational ASCAL verification with inline ASCAL in high volume manufacturing fab for ArF XT:1460K with LOCO-B Day2A_PM8_JieDu.pdf
Day2-B-AM-1 Qiang Wu (Fudan University): (INVITED) The Discussion of the Typical BEOL Design Rules from 3 nm to 2 nm Logic Process with EUV and High NA EUV Lithography Day2B_AM1_QiangWu.pdf
Day2-B-AM-2 Germain Fenger (Siemens EDA) (INVITED) Predict the curve for the most advanced technology nodes
Day2-B-AM-3 Jianliang Li (AMEDAC 全芯智造) (INVITED) An innovative method to retain optical kernels by keeping Bossung curves smoothness Day2B_AM3_JianliangLi.pdf
Day2-B-AM-4 Zongchang Yu (DJEL) (INVITED) A novel approach makes yield more predictable
Day2-B-AM-5 Toshihiro Oga (Gigaphoton) (INVITED) ArF lightsource “GT66A” for next-generation immersion lithography enhancing EPE and CD performance
Day2-B-AM-6 Jiaqi Liu (Shanghai Huali) (INVITED) Pattern Centric Machine Learning Approach to Uncover Process Defects During Wafer Inspection and Review Day2B_AM6_JiaqiLiu.pdf
Day2-B-PM-1 XuanMing Duan (Jinan University 暨南大学) (INVITED) Sub-Diffraction Lithography with Ultrafast Laser
Day2-B-PM-2 Xiaobin Xu (Tongji University 同济大学) (INVITED) Exploitation of large-area nanoscale-patterning approaches and their applications in nanodevices
Day2-B-PM-3 Jie Liu (Hunan University 湖南大学) HNU-EBL: A Software Toolkits for Electron Beam Lithography Simulation and Optimization Day2B_PM3_JieLiu.pdf
Day2-B-PM-4 RAN JI (Qingdao Germanlitho Co.,Ltd青岛天仁微纳公司) Industrial application of nano-imprint in the production of micro - nano optical devices Day2B_PM4_RanJi.pdf
Day2-B-PM-5 Jiao Huang (ASML) Genetic algorithm to speed up modeling turn-around-time Day2B_PM5_JiaoHuang.pdf
Day2-B-PM-6 Rongzheng Ding (Fudan University) HD SRAM size shrink beyond 7nm by CFET without EUV Day2B_PM6_RongzhengDing.pdf
Day2-B-PM-7 Yanli Li (Fudan University) A Study of the Advantages to the Photolithography Process brought by the HiNA EUV Exposure Tool Day2B_PM7_YanliLi.pdf
Day2-B-PM-8 Yingfang Wang (HFC) Modeling Sampling Strategy Optimization by Machine Learning Based Analysis Day2B_PM8_YingfangWang.pdf




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