Group Photo could be download here -- IWAPS2019GroupPhoto.jpg.
Cite: Author Name, "Presentation Title," the 3rd International Workshop on Advanced Patterning Solutions (IWAPS2019), Nanjing China, 17-18, Oct, 2019.
| No | Author | Presentation Title | Download |
| Day1-AM-1 | Patrick Naulleau (Lawrence Berkeley National Lab) | EUV Lithography: Current Status and Remaining Challenges |
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| Day1-AM-2 | Jeongdong Choe (TechInsights) | Technology Views on 3D NAND Flash: Current and Future | IWAPS2019-1-A2-JeongdongChoe.pdf |
| Day1-AM-3 | Jo Finders (ASML) | EUV lithography: update on scanner and infrastructure progress |
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| Day1-AM-4 | Hiromitsu Maejima (TEL) | Coater/Developer System Latest Technology | IWAPS2019-1-A4_HiromitsuMaejima.pdf |
| Day1-AM-5 | Keita Sakai (Canon) | Latest status of nanoimprint system for semiconductor device manufacturing |
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| Day1-PM-1 | Ilhami Torunoglu, Liang Cao (Mentor) | ML Platform and applications | IWAPS2019-1-P1_IlhamiTorunoglu.pdf |
| Day1-PM-2 | Chris Spence (ASML Brion) | OPC Model Accuracy and Roadmap | IWAPS2019-1-P2_ChrisSpence.pdf |
| Day1-PM-3 | Xiangyu Zhou (Synopsys) |
Resolving mask correction challenges on implant layers ——Topography-aware rigorous flow deployment in advanced device manufacturing |
IWAPS2019-1-P3_XiangyuZhou.pdf |
| Day1-PM-4 | Zhiyang Song (YMTC) | OPC Modeling with Image Processing on 3D NAND Via Layer |
|
| Day1-PM-5 | Bin Zhao (HLMC) | Development & mass production management of sub-20nm half pitch with ArF immersion and SADP process |
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| Day1-PM-6 | Wei Yuan (Shanghai IC R&D Center) | Machine Learning SRAF improves OPC Performance at 1X node and below |
IWAPS2019-1-P6_WeiYuan.pdf |
| Day2A-AM-1 | Henry Kamberian (Photronics) | Mask Pattern Fidelity Considerations in EUV Mask Technology |
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| Day2A-AM-2 | Rolf Seltmann (Zeiss) | Improving Chip Performance by Photomask Tuning: Ultimate Mask CD control as a major part of an overall excursion prevention strategy |
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| Day2A-AM-3 | Tommy Oga (Gigaphoton) | Next generation ArF lightsource “GT65A” for cutting-edge immersion lithography providing both improvement on availability and performance | IWAPS2019-2A-A3_TommyOga.pdf |
| Day2A-AM-4 | Will Conley (Cymer) | Multi-focal imaging for improved depth of focus: principles and application to ArF Immersion Lithography |
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| Day2A-AM-5 | Qiang Wu (Shanghai IC R&D Center) | The Photolithography Process Design for 5 nm Logic Process Flow | IWAPS2019-2A-A5_QiangWu.pdf |
| Day2A-AM-6 | Lisong Dong (IMECAS) | Source optimization and mask defect compensation by EUV lithography simulation |
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| Day2A-PM-1 | Yanxiang Liu (Hisilicon) | Patterning challenges and DTCO for the fast product ramp-up at 14/12nm technology node |
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| Day2A-PM-2 | Wenzhan Zhou (HLMC ) | DFM: “Design for Manufacturing” or “Design Friendly Manufacturing” |
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| Day2A-PM-3 | Liang Cao (Mentor) | Machine Learning Platform in DTCO |
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| Day2A-PM-4 | Liang Zhu (Synopsys) | A Study of 2D Assist Feature Placement |
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| Day2A-PM-5 | Yushu Yang (Shanghai IC R&D Center) | Key Process Approach Recommendation for 5 nm Logic Process Flow with EUV Photolithography |
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| Day2A-PM-6 | Yu Ding (Shanghai IC R&D Center) | The Device Design for 5 nm Logic Process Flow |
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| Day2B-AM-1 | Kevin Huang (KLA) | Future patterning challenges: It’s not 2D, it’s 3D | IWAPS2019-2B-A1_KevinHuang.pdf |
| Day2B-AM-2 | Abhishek Vikram (Anchor Semiconductor) | More Efficient Patterning Defect Inspection and Metrology - Advancing the Current Capability |
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| Day2B-AM-3 | Andrew Zhang (YMTC) | Metrology challenges in 3D NAND flash technical development and manufacturing |
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| Day2B-AM-4 | Xiaoye Ding (YMTC) | White light Interference Solution for High Performance 3D NAND VIA Dishing Metrology |
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| Day2B-AM-5 | Takanori Kawakami (JSR) | Advanced Lithography Material Status toward 5nm Node and beyond |
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| Day2B-AM-6 | Dimitrios Kazazis (Paul Scherrer Institute) | Extreme ultraviolet interference lithography for high-resolution patterning and resist testing |
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| Day2B-AM-7 | Vincent Chen (Pibond) | Enabling silicon-based materials for advanced and novel semiconductor manufacturing processes |
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| Day2B-AM-8 | Huayong Hu (Jiangsu Hantop) | Photoresist Product Development at Jiangsu Hantop Photomaterial Company | IWAPS2019-2B-A8_HuayongHu.pdf |
| Day2B-PM-1 | Shengxiang Ji (Changchun Institute of Applied Chemistry, CAS) | Directed Self-assembly of High-X Block Copolymers on Chemical Patterns for Sub-10 nm Patterning |
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| Day2B-PM-2 | Deqiang Wang (Chongqing Institute of Green and Intelligent Technology, CAS) | Fabrication 2D/3D nanopore with Helium Ion Microscope for DNA sequencing |
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| Day2B-PM-3 | Hai Deng (Fudan University) | Development of High Resolution Advanced Lithographic Patterning Materials |
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| Day2B-PM-4 | Huigao Duan (Hunan University) | Sketch and Peel Lithography for Multiscale Patterning |
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| Day2B-PM-5 | Yanqing Wu (Shanghai Advanced Research Institute) | EUV lithography resist testing and nano-periodic structure fabrication based on SSRF-XIL station: application and prospects | IWAPS2019-2B-P5_YanqingWu.pdf |
| Day2B-PM-6 | Xiaolong Wang (Paul Scherrer Institute) | Second order diffraction EUV interference lithography for the study of high-resolution EUV resists | IWAPS2019-2B-P6_XiaolongWang.pdf |
| Day2B-PM-7 | Meng Su (Institute of Chemistry, CAS) | Self-assembling of Nanomaterials via Droplet Manipulation for Multi-dimensional Micro/nanostructures |
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Please Download the Agenda of IWAPS2019 Here IWAPS2019Agenda.pdf
* Agenda is subject to change
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